Ordyl ® Alpha 800


Ordyl ® Alpha 800 is a negative, aqueous universal dry film designed to be used for the most common PCB applications.
Alpha 800 can be exposed with LDI or with standard UV lamps and is developable and strippable in mildly alkaline solutions.
It offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
Ordyl Alpha 800 is particularly recommended for innerlayers thanks to excellent developing properties that leaves the copper surface very clean and ready for the black oxide process.
This type of dry film ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 μm thickness.

Main Features

  • Extremely flexible and high conformability
  • Easy stripping with small flake size

Typical Application

  • Acid etching
  • Tenting process
  • Copper, tin, tin/lead plating

Available Thickness

  • 25 μm (1.0 mils) and 30 μm (1.2 mils) for Innerlayer process
  • 40 μm (1.6 mils) and 50 μm (2 mils) for standard application


We recommend using UV lamps or laser source with emission peak at 360 - 405 nm.
The following parameters are referred to:
6-9 Solid STEP of SST21
10-18 Solid STEP of RST25
The following parameters are referred to: 8 Solid STEP of SST21
Alpha 825Alpha 830Alpha 840Alpha 850
Energy (mJ/cm²)25-3030-3535-4540-50
Resolution20µm (0.8 mils)30µm (1.2 mils)40µm (1.6 mils)50µm (2 mils)

Developing (B.P. 60%)

Alpha 825Alpha 830Alpha 840Alpha 850
Developing time20 sec.25 sec.35 sec.50 sec.
Dry Film load 1g/l0.05 m²/l0.03 m²/l0.025 m²/l0.017 m²/l
We recommend a maximum Dry Film load of 5 g/l.