PROCESS | RANGE | OPTIMUM |
---|---|---|
Spray Pressure | 1.0 bar - 2.0 bar | 1.5 bar |
Temperature | 25° - 35°C | 30°C |
Contact Time | 20-80 sec. | Depend on application |
Copper Removal | 0.5 - 1.5 µm | Depend on application |
PROCESS | RANGE | OPTIMUM |
---|---|---|
H2SO4; | 6% - 14% v / v | 10% v / v |
Spray Pressure | 1.0 - 2.0 bar | 1.5 bar |
Temperature | Room temperature | Room temperature |
Contact Time | 10 - 20 sec. | 15 sec. |