PRODUCT
DESCRIPTION

TECHNICLEAN 688 is a liquid acid cleaner specifically formulated to produce a clean slightly etched surface; it can remove oxides, finger- prints, light oils and other soils from copper or copper alloys. Techniclean 688 can be used in either soak or spray applications.
The product not only provides more effective soil removal, but is easly rinsed. Tecniclean 688 is compatible with most dry films and screening inks. The use of Techniclean 688 followed by Technietch D-688TC ensures excellent copper surface preparation improving performance of sub- sequent processes (dry film lamination, soldermask application and HAL applications).

Operating Parameters

PARAMETERSRANGEOPTIMUM
Sulphuric Acid (d=1.84 g/cm³)40 - 60 ml/l50 ml/l
H2O2 (130 vol)30 - 50 ml/l40 ml/l
Copper2 - 25 g/l25 g/l max
Temperature30°C - 40°C35°C
Contact Time15 - 60 sec.40 sec.

PERFORMANCE TECNICLEAN 688

FingerprintsPermanent MarkerOXIDE
BEFORE TREATMENT
AFTER 40 sec. at 35°C