Ordyl ® P50000


Ordyl ® P50000 is a negative, aqueous processable dry film designed to be exposed with standard UV lamps and usable also with LDI.
Ordyl P50000 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
Ordyl P50000 is available in minimum thickness of 100 μm to avoid double lamination of standard dry film. It is indicated for direct plating process where high thickness depositions are required thanks to the excellent through-cure polymerization due to special photoinitiator system.

Main Features

  • Excellent through cure polymerization also over 100 μm thickness

Typical Application

  • Copper, tin, tin/lead plating
  • Packaging
  • Electroforming

Available Thickness

  • 100 μm (4.0 mils)
  • 125 μm (5.0 mils)


We recommend using UV lamps or laser source with emission peak at 360 - 380 nm.
The following parameters are referred to:
7-9 Solid STEP of SST21
7-18 Solid STEP of RST25
he following parameters are referred to: 8 Solid STEP of SST21
P 50100P 50125
Energy (mJ/cm²)120-150150-180
Resolution100 µm (4 mils)125 µm (5 mils)

Developing (B.P. 60%)

P 50100P 50125
Developing time120 sec.150 sec.
Dry Film load 1g/l0.008 m²/l0.006 m²/l
We recommend a maximum Dry Film load of 3 g/l.