Ordyl ® P50000is a negative, aqueous processable dry film designed to be exposed with standard UV lamps and usable also with LDI.
Ordyl P50000 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
Ordyl P50000 is available in minimum thickness of 100 μm to avoid double lamination of standard dry film. It is indicated for direct plating process where high thickness depositions are required thanks to the excellent through-cure polymerization due to special photoinitiator system.
Excellent through cure polymerization also over 100 μm thickness
Typical Application
Copper, tin, tin/lead plating
Packaging
Electroforming
Available Thickness
100 μm (4.0 mils)
125 μm (5.0 mils)
Exposure
We recommend using UV lamps or laser source with emission peak at 360 - 380 nm.
The following parameters are referred to:
7-9 Solid STEP of SST21
7-18 Solid STEP of RST25
he following parameters are referred to: 8 Solid STEP of SST21