PRODUCT
DESCRIPTION

MICROTECH 3100 is a copper etchant product used in the in the pre-treatment cycles prior to electroless copper deposition and acid copper plating. It can also be used for microetching many copper-based substrates. Microetch 3100 is particularly effective in etching both electroless and electroplated copper surfaces prior to processing through the electroless nickel and immersion gold, as well as many copper surfaces commonly used in the connector industry.

Make-up Procedure

COMPONENTQUANTITY
Microtech 3100100 g/l
Sulphuric Acid (d=1.84)20 ml/l
DI waterTo volume
ETCHING: Laminate/Electrolytic Copper (PC Fabrication, ENIG, & Connector Applications)
COMPONENTQUANTITY
Microtech 310030-60 g/l
Sulphuric Acid (d=1.84)20 ml/l
DI waterTo volume
ETCHING: Laminate/Electrolytic Copper (PC Fabrication, ENIG, & Connector Applications)