Ordyl ® FP 400is a negative, aqueous processable dry film designed to be exposed with LDI and standard UV lamps.
FP 400 is a special Dry Film specifically designed to obtain Ultra-Fine Line pattern. FP 400 is developable and strippable in mildly alkaline solu- tions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
This type of dry film ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 μm thickness.
Excellent resolution up to 1:2 (i.e. with 40 μm thickness it can be obtained 20 μm of resolution)
Copper, tin, tin/lead plating
15 μm (0.6 mils) for Ultra Fine Line
25 μm (1.0 mils) for Ultra Fine Line
40 μm (1.6 mils) for Ultra Fine Line
50 μm (2 mils) for Ultra Fine Line
Optimal exposure at 6 Solid STEP of SST21 (7-9 Solid STEP of RST25).
We recommend to stay between 5-8 Solid STEP of SST21 (4-15 Solid STEP of RST25).
The following parameters are referred to: 6 Solid STEP of SST21