Ordyl ® AM 900 is a negative, aqueous processable dry film designed to be exposed both with sources at 405nm wavelength, double wavelength systems (when one is 405nm) and standard UV sources.
AM 900 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
Ordyl AM 900 has good adhesion on copper surface and for this reason is indicated for direct plating process and in case of surface preparation is not good.
This type of dry film ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 μm thickness.

Main Features

  • Excellent through cure polymerization
  • Good adhesion properties
  • Very High Photospeed
  • High flexibility and conformability

Typical Application

  • Acid etching
  • Tenting process
  • Copper, tin, tin/lead plating

Available Thickness

  • 30 µm (1.2 mils)
  • 40 µm (1.6 mils)
  • 50 µm (2 mils)
  • 60 µm (2.4 mils)
  • 75 µm (3.0 mils)


We recommend using UV lamps or laser source with emission peak at 405 nm The following parameters are referred to:
6 - 7 Solid STEP of SST21
16 - 21 Solid STEP of SST41
7 - 12 Solid STEP of RST25
AM 930AM 940AM 950AM 960AM 975
Energy (mJ/cm²)14-2016-2218-2422-2835 - 45
Resolution30 µm (1.2 mils)40 µm (1.6 mils)50 µm (2 mils)60 µm (2.4 mils)75 µm (3.0 mils)