Ordyl ® AM 100DI


Ordyl ® AM 100DI is a negative, aqueous processable dry film specifically designed to be exposed with LDI but usable also with standard UV lamps.
AM 100DI is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
Ordyl AM 100DI has strong adhesion on copper surface and for this reason is indicated for direct plating process and in case of surface preparation is not good.
This type of dry film ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 μm thickness.

Main Features

  • Excellent through cure polymerization also with LDI exposure machine over 50μm resist thickness
  • Excellent adhesion properties due to special adhesion promoter
  • Very High Photospeed
  • High flexibility and conformability

Typical Application

  • Acid and alkaline etching
  • Tenting process
  • Copper, tin, tin/lead plating
  • Nickel and Gold plating

Available Thickness

  • 20 μm (0.8 mils) for Ultra Fine Line
  • 30 μm (1.2 mils), 40 μm (1.6 mils), 50 μm (2 mils) and 60 μm (2.4 mils) for standard application


We recommend using UV lamps or laser source with emission peak at 360 - 405 nm.
The following parameters are referred to:
6-9 Solid STEP of SST21
7-17 Solid STEP of RST25
The following parameters are referred to: 8 Solid STEP of SST21
AM 120DIAM 130DIAM 140DIAM 150DIAM 160DI
Energy (mJ/cm²)12-1815-2520-3025-3525-40
Resolution20 µm (0.8 mils)30 µm (1.2 mils)40 µm (1.6 mils)50 µm (2 mils)60 µm (2.4 mils)

Developing (B.P. 60%)

AM 120DIAM 130DIAM 140DIAM 150DIAM 160DI
Developing time20 sec.30 sec.40 sec.60 sec.80 sec.
Dry Film load 1g/l0.05 m²/l0.03 m²/l0.025 m²/l0.017 m²/l0.012 m²/l
We recommend a maximum Dry Film load of 3 g/l.