Ordyl ® AM 100


Ordyl ® AM 100 is a negative, aqueous processable dry film specifically designed to be exposed with LDI but usable also with standard UV lamps. AM 100 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
Ordyl AM 100 has good adhesion on copper surface and for this reason is indicated for direct plating process and in case of surface preparation is not good. This type of dry film ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 μm thickness.

Main Features

  • Excellent through cure polymerization also with LDI exposure machine
  • Good adhesion properties
  • High Photospeed
  • High flexibility and conformability

Typical Application

  • Acid and alkaline etching
  • Tenting process
  • Copper, tin, tin/lead plating
  • Nickel and Gold plating

Available Thickness

  • 30 μm (1.2 mils), 40 μm (1.6 mils) and 50 μm (2 mils) for standard application
  • 75 μm (3 mils) specific for Nickel and Gold plating


We recommend using UV lamps or laser source with emission peak at 360 - 405 nm.
The following parameters are referred to:
6-9 Solid STEP of SST21
10-18 Solid STEP of RST25
The following parameters are referred to: 8 Solid STEP of SST21
AM 130AM 140AM 150Am 175
Energy (mJ/cm²)25-3025-3030-3550-60
Resolution30µm (1.2 mils)40µm (1.6 mils)50µm (2 mils)75µm (3 mils)

Developing (B.P. 60%)

AM 130AM 140AM 150AM 175
Developing time30 sec.40 sec.60 sec.95 sec.
Dry Film load 1g/l0.03 m²/l0.025 m²/l0.017 m²/l0.008 m²/l
We recommend a maximum Dry Film load of 5 g/l.