Ordyl ® Alpha 900


Ordyl ® Alpha 900 is a negative, aqueous universal dry film designed to be used for the most common PCB applications.
Alpha 900 can be exposed with LDI or with standard UV lamps and is developable and strippable in mildly alkaline solutions.
It offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
Ordyl Alpha 900 guarantee very good adhesion on copper surface.
This type of dry film ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 μm thickness.

Main Features

  • Extremely flexible and high conformability
  • Good through cure polymerization
  • Easy stripping with small flake size

Typical Application

  • Acid etching
  • Tenting process
  • Copper, tin, tin/lead plating

Available Thickness

  • 20 μm (0.8 mils) for Ultra Fine Line
  • 30 μm (1.2 mils), 40 μm (1.6 mils), 50 μm (2 mils) and 60 μm (2.4 mils) for standard application


We recommend using UV lamps or laser source with emission peak at 360 - 405 nm.
The following parameters are referred to:
6-9 Solid STEP of SST21
10-18 Solid STEP of RST25
The following parameters are referred to: 8 Solid STEP of SST21
Alpha 920Alpha 930Alpha 940Alpha 950Alpha 960
Energy (mJ/cm²)20-2525-3030-3535-4045-50
Resolution20 µm (0.8 mils)30 µm (1.2 mils)40 µm (1.6 mils)50 µm (2 mils)60 µm (2.4 mils)

Developing (B.P. 60%)

Alpha 920Alpha 930Alpha 940Alpha 950Alpha 960
Developing time15 sec.25 sec.35 sec.50 sec.65 sec.
Dry Film load 1g/l0.05 m²/l0.03 m²/l0.025 m²/l0.017 m²/l0.012 m²/l
We recommend a maximum Dry Film load of 3 g/l.