Ordyl ® Alpha 300

PRODUCT
DESCRIPTION

Ordyl ® Alpha 300 is a negative, aqueous dry film specifically designed to have extremely high resistance in alkaline solutions and galvanic Nickel/ Gold. It can be exposed both with LDI and standard UV lamps.
Alpha 300 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.
Ordyl Alpha 300 guarantee good adhesion on copper surface.
This type of dry film has a good flexibility and ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 μm thickness.

Main Features

  • Extreme resistance in alkaline solutions
  • High resistance in Ni-Au Plating

Typical Application

  • Acid and alkaline etching
  • Tenting process
  • Copper, tin, tin/lead plating
  • Ni-Au Plating

Available Thickness

  • 30 μm (1.2 mils) for acid and alkaline etching
  • 40 μm (1.6 mils) and 50 μm (2mils) for standard application and Ni-Au Plating
  • 75 μm (3 mils) for standard application, Ni-Au Plating and tin/leads stripping mask

Exposure

We recommend using UV lamps or laser source with emission peak at 360 - 380 nm.
The following parameters are referred to:
7-9 Solid STEP of SST21
10-18 Solid STEP of RST25
The following parameters are referred to: 8 Solid STEP of SST21
Alpha 330Alpha 340Alpha 350Alpha 375
Energy (mJ/cm²)40-6050-7080-100100-120
Resolution30 µm (1.2 mils)40 µm (1.6 mils)50 µm (2 mils)75 µm (3 mils)

Developing (B.P. 60%)

Alpha 330Alpha 340Alpha 350Alpha 375
Developing time40 sec.55 sec.75 sec.120 sec.
Dry Film load 1g/l0.03 m²/l0.025 m²/l0.017 m²/l0.012 m²/l
We recommend a maximum Dry Film load of 3 g/l.