ACID COPPER cu230 is designed for through-hole printed circuit board applications as a high throw, micro-levelling acid copper electroplating process. The electrodeposits produced by the Acid Copper Cu 230 process are fine grained equiaxed, high purity, ductile copper deposits from a single additive system, providing advanced technology from an economical solution that will meet or exceed all the requirements of MIL-P-55110-D and BS9760.
All of the components in the process are fully analyzable and the Acid Copper Cu 230 process is specifically optimized for on-line analysis and control by EBA automated bath analysis equipment or by HPLC.

Main Features

  • Specifically engineered for Direct Current applications to produce even, bright deposits from a stable electrolyte
  • Economical to use
  • High purity fine grained, equiaxed deposits
  • Excellent over-plating and soldering properties
  • Flexible enough to work with airless (E-ductors) and standard conventional DC plating tank configurations
  • Easily controlled by EBA-Analysis, and/or auto-dosing methodologies

Operating Parameters

Copper Sulphate Pentahydrate (CuSO4 * 5H2O)60-90 g/l75 g/l
Copper Metal15-22.5 g/l18.75 g/l
Sulphuric Acid (96% Pure Grade)185-195 g/l190 g/l
Chloride Ion40-80 g/l60 ppm
CU 230 Brightener Make-Up0.5-7.5 ml/l3 ml/l
CU 230 Carrier Make-Up3-15 ml/l7.5 ml/l
Cathode Curren Density0.5-5 A/dm2
Anode Current Density0.75-2.0 A/dm2
Anode to Cathode Distance15-30 cm (20 cm optimum)
Reciprocal Cathode Rod and Oil Free Air Sparger/E-ductors
Vigorous air movement: • 0.035 kg/cm2 for each meter of solution depth • 0.09 - 0.18 m3/min for each meter of sparger length from pumps or E-ductors and cathode rod 5-10cm excursion, 4-5 cycles/min.
Filtration Rate3 tank volume turnovers per hour
Deposition Rate42μm/hour at 3A/dm2 and under at optimum operating parameters