Catalog

Ordyl® AM 100DI

Main Features:

  • Excellent through cure polymerization also with LDI exposure machine over 50μm resist thickness
  • Excellent adhesion properties due to special adhesion promoter
  • Very High Photospeed
  • High flexibility and conformability

Typical Application:

  • Acid and alkaline etching
  • Tenting process
  • Copper, tin, tin/lead plating
  • Nickel and Gold plating

Available Thickness:

  • 20 μm (0.6-0.8 mils) for Ultra Fine Line
  • 30 µm (1.2 mils), 40 µm (1.6 mils), 50 µm (2 mils) and 60 μm (2.4 mils) for standard application

Exposure

 

 

AM 120DI

AM 130DI

AM 140DI

AM 150DI

AM 160DI

Energy (mJ/cm2)

 

12-18

15-20

20-25

20-25

25-30

Resolution

 

20 µm

(0.8 mils)

30 µm

(1.2 mils)

40 µm

(1.6 mils)

50 µm

(2 mils)

60 µm

(2.4 mils)

Photogallery
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