Catalog

Ordyl® Alpha 900NDI

Main Features:

  • Absence of developing sludge
  • Especially developed for UV and LASER exposure machine
  • Very good through cure polymerization also with LDI exposure machine over 50 μm resist thickness
  • Easy stripping with small flake size

Typical Application:

  • Acid etching
  • Tenting process
  • Copper, tin, tin/lead plating

Available Thickness:

  • 20 μm (0.8 mils) for Ultra Fine Line
  • 30 µm (1.2 mils), 40 µm (1.6 mils), 50 µm (2 mils) and 60 μm (2.4 mils) for standard application

Exposure

 

Alpha930NDI

Alpha940NDI

Alpha950NDI

Alpha960NDI

Energy (mJ/cm2)

20-25

25-30

30-35

35-40

Resolution

30 µm (1.2 mils)

40 µm (1.6 mils)

50 µm (2mils)

60 µm (2.4 mils)

Photogallery
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