Catalog

Ordyl® Alpha 300

Main Features:

  • Extreme resistance in alkaline solutions
  • High resistance in Ni-Au Plating

Typical Application:

  • Acid and alkaline etching
  • Tenting process
  • Copper, tin, tin/lead plating
  • Ni-Au Plating

Available Thickness:

  • 30 µm (1.2 mils) for acid and alkaline etching
  • 40 µm (1.6 mils) and 50 µm (2mils) for standard application and Ni-Au Plating
  • 75 μm (3 mils) for standard application, Ni-Au Plating and tin/leads stripping mask

Exposure

 

Alpha330

Alpha340

Alpha350

Alpha375

Energy (mJ/cm2)

40-60

50-70

80-100

100-120

Resolution

30 µm (1.2 mils)

40 µm (1.6 mils)

50 µm (2 mils)

75 µm (3 mils)

Photogallery
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