Catalog

Ordyl® AM 100

Main Features:

  • Excellent through cure polymerization also with LDI exposure machine
  • Good adhesion properties
  • High Photospeed
  • High flexibility and conformability

Typical Application:

  • Acid and alkaline etching
  • Tenting process
  • Copper, tin, tin/lead plating
  • Nickel and Gold plating

Available Thickness:

  • 30 µm (1.2 mils), 40 µm (1.5 mils) and 50 µm (2 mils) for standard application
  • 75 μm (3 mils) specific for Nickel and Gold plating 

Exposure

 

AM 130

AM 140

AM 150

AM 175

Energy
(mJ/cm2)

20-25

25-30

30-35

50-60

Resolution

30 µm (1.2 mils)

40 µm (1.5 mils)

50 µm (2 mils)

75 µm (3 mils)

Photogallery
Attachments

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