Catalog

Ordyl® FLR 1000

Main Features:

  • Excellent through cure polymerization also with LDI exposure machine over 50μm resist thickness
  • Excellent adhesion properties due to special adhesion promoter
  • High Photospeed
  • High flexibility and conformability
  • Very small flake size in stripping

Typical Application:

  • Acid etching
  • Tenting process
  • Copper, tin, tin/lead plating

Available Thickness:

  • 30 µm (1.2 mils), 40 µm (1.6 mils), 50 µm (2 mils) and 60 μm (2.4 mils) for standard application

Exposure

 

 

FLR 1030

FLR 1040

FLR 1050

FLR 1060

 

Energy (mJ/cm2)

 

15-25

20-30

25-35

35-45

 

Resolution

 

30 µm

(1.2 mils)

40 µm

(1.6 mils)

50 µm

(2.0 mils)

60 µm

(2.3 mils)

 

Photogallery
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