Catalog

Ordyl® AM 900

Main Features:

  • Excellent through cure polymerization
  • Good adhesion properties
  • Very high photospeed
  • High flexibility and conformability

Typical Application:

  • Acid etching
  • Tenting process
  • Copper, tin, tin/lead plating

Available Thickness:

  • 30 µm (1.2 mils), 40 µm (1.6 mils), 50 µm (2.0 mils) and 60 µm (2.4 mils) for standard application

 

Exposure

We recommend using sources with emission peak at 405nm or double wavelength exposure systems (when one is 405nm).

The following parameters are referred to:

  • 6-9 solid STEP of SST21
  • 16-27 solid STEP of SST41
  • 7-18 solid STEP of RST25

 

AM 930

 AM 940

AM 950

AM 960 

Energy
(mJ/cm2)

14-20

16-22 18-24

 22-28

Resolution

30 µm (1.2 mils)

40 µm (1.6 mils) 

50 µm (2.0 mils)

60 µm (2.4 mils) 

Photogallery
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