Catalog

Ordyl® AM 400

Main Features:

  • Excellent through cure polymerization
  • Good adhesion properties
  • Very high photospeed
  • High flexibility and conformability

Typical Application:

  • Acid and alkaline etching
  • Tenting process
  • Copper, tin, tin/lead plating
  • Nickel and Gold plating

Available Thickness:

  • 30 µm (1.2 mils) for standard application

 

Exposure

We recommend using sources with emission peak at 405nm.

The following parameters are referred to:

  • 5-7 solid STEP of SST21 - Oprtimal 6
  • 13-19 solid STEP of SST41 - Oprtimal 16
  • 4-10 solid STEP of RST25 - Oprtimal 7

 

AM 430

Energy
(mJ/cm2)

9 - 18

Resolution

30 µm (1.2 mils)

 

 

 
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