Catalog

LSL-ST-I-EE

LSL-ST-I-EE is a product specially formulated for stripping solder mask even after the final curing.

The solder mask stripper LSL-ST-I-EE offers the following advantages:

  • Allows recoating of solder mask after defective product has been fully cured.
  • No attack to the basic material occurs, epoxy resin is unaffected.
  • No attack on copper, tin, tin/lead, nickel or gold occurs.
  • LSL-ST-I-EE can be used diluted and used as a cleaning product.

LSL-ST-I-EE is used for stripping fully cured solder mask and UV cured screen printing inks.

Stripping

The stripping time depends on the type, layer thickness and curing degree of solder mask.

The following tables contain typical stripping time values:

Manually:

Layer Thickness

Temperature

Stripping Time

20µm to 30µm

40°C to 45°C

6 hours

60°C to 70°C

30 minutes

70°C to 75°C

25 minutes

80°C to 90°C

9 to 18 minutes

90°C to 100°C

5 to 7 minutes

More than 30µm

40°C to 45°C

8 hours

60°C to 70°C

35 minutes

70°C to 75°C

27 minutes

80°C to 90°C

12 to 20 minutes

90°C to 100°C

10 minutes

Conveyorized equipment

Layer Thickness

Temperature

Stripping Time

Pressure

20µm to 30µm

60°C to 70°C

3 to 5 minutes

18 to 22 bar

More than 30µm

65°C to 80°C

4 to 6 minutes

18 to 22 bar

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