Catalog

Microetch 3100

Microetch 3100 is a copper etchant product used in the in the pre-treatment cycles prior to electroless copper deposition and acid copper plating.

It can also be used for microetching many copper-based substrates.

Microetch 3100 is particularly effective in etching both electroless and electroplated copper surfaces prior to processing through the electroless nickel and immersion gold, as well as many copper surfaces commonly used in the connector industry.

Make-Up Procedure

Etching: Laminate/Electrolytic Copper – (PC Fabrication, EN¬IG, & Connector Applications)

Component

Quantity

Microetch 3100

100g/l

Sulphuric Acid (d=1.84)

20ml/l

DI water

To volume

Etching: Electroless Copper – (PC Fabrication Applications)

Component

Quantity

Microetch 3100

30 – 60g/l

Sulphuric Acid (d=1.84)

20ml/l

DI water

To volume

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