Catalog

Techniclean 688

Techniclean 688 is a liquid acid cleaner specifically formulated to produce a clean slightly etched surface; it can remove oxides, fingerprints, light oils and other soils from copper or copper alloys.

Techniclean 688 can be used in either soak or spray applications.

The product not only provides more effective soil removal, but is easly rinsed.

Tecniclean 688 is compatible with most dry films and screening inks.

The use of Techniclean 688 followed by Technietch D-688TC ensures excellent copper surface preparation improving performance of subsequent processes (dry film lamination, soldermask application and HAL applications).

Operating Parameters:

Parameters

Range

Optimum

Sulphuric Acid (d=1.84g/cm3)

40 – 60ml/l

50ml/l

H2O2 (130 vol)

30 – 50ml/l

40ml/l

Copper

2 – 25g/l

25g/l max

Temperature

30 – 40°C

35°C

Contact time

15 – 60seconds

40seconds

 

Performance Techiclean 688

 

Before Treatment

After 40sec at 35°C

Fingerprints

Permanent Marker

Oxide

Photogallery
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