Catalog

Technitech 1118

TechniEtch 1118 is a proprietary ammonia-free, persulfate microetch designed to provide improved topography over standard persulfate and peroxide chemistry at the same etch depth.

This topography will improve resist or plating adhesion which becomes critical when processing parts with fine features.

The microetch is effective for both electroless and electroplated copper surface treatment and will provide additional cleaning and some tarnish resistance.

TechniEtch 1118 can be used in horizontal or vertical equipment and for various applications including surface treatment prior to resist, electrolytic and electroless copper plating, electroless nickel as well as many copper surfaces commonly used in connector and lead frame manufacturing processes.

Main Features:

  • High copper solubility levels.
  • Ammonia free.
  • Stable chemistry.
  • Cost effective replacement for generic persulfate and peroxide microetch.
  • Good copper topography with consistent etch rates.
  • A stable etching rate with uniform copper etching.
  • Environmentally friendly with simple waste treatment.
  • Compatible with subsequent electrolytic end electroless processes.

Operating Parameters:

Parameters

Range

Optimum

TechniEtch 1118 Make-Up

50 – 70g/l

60g/l

TechniEtch 1118 Additive

50 – 70ml/l

60ml/l

Contact time

30sec – 5min

Dependent on Application

Copper removal

0.5 - 1.1µm/min

Dependent on Application

Temperature

28 – 32°C

30°C

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