Catalog

Technietch D-688TC

Technietch D-688TC is an organic acid based copper microetch specially formulated to be used in a wide variety of pretreatment applications.

Technietch D-688TC ensures an excellent surface preparation with an optimum copper topography leading to improved performance of subsequent processes (dry film, soldermask, hot air solder levelling).

Main Features:

  • High copper solubility levels.
  • Excellent copper topography with outstanding performance for dry film and soldermask.
  • A stable etching rate with uniform copper etching.
  • Tolerant of chlorides (de-ionised water not required for make-up).
  • Clear pink consistent appearance: simple AOI inspection.
  • Easy effluent disposal: contains no chelating agents.
  • Environmentally friendly with simple waste treatment.

Operating Parameters:

Process

Range

Optimum

Technietch D-688TC

 

 

Spray Pressure

1.0 bar- 2.0 bar

1.5 bar

Temperature

25- 35°C

30°C

Contact time

20-80 seconds

Dependent on Application

Copper removal

0.5-1.5µm

Dependent on Application

Acid Rinse

 

 

HCl concentration

6-14% v/v

10% v/v

Spray Pressure

1.0-2.0 bar

1.5 bar

Temperature

Room temperature

Contact time

10-20 seconds

15 seconds

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