Catalog

Ordyl® P 50000

Main Features:

  • Excellent through cure polymerization also over 100 μm thickness

Typical Application:

  • Copper, tin, tin/lead plating
  • Packaging

Available Thickness:

  • 100 µm (4.0 mils) and 125 µm (5.0 mils)

Exposure

 

P50100

P50125

Energy
(mJ/cm2)

120-150

150-180

Photogallery
Attachments